Credence Systems Corp. (Nasdaq: CMOS) provides automated test equipment (ATE) solutions to the rapidly growing worldwide semiconductor industry. The company today announced its MultiWave instrument for the Diamond test platform has received the Advanced Packaging Best New Product Award in the Test and Services category, an award that recognizes the company’s advances in the competitive market.

Lavi Lev, president and CEO of Credence, said the MultiWave provides a low cost solution for multisite testing. The system incorporates four arbitrary waveform generators and four digitizers into a single compact instrument that allows for concurrent testing of audio and video system-in-package (SiP) and system-on-chip (SoC) devices.

“We are committed to offering our customers the best value in test, and the Diamond MultiWave instrument solves a full range of testing challenges for cost competitive markets. High-level integration combined with the lowest cost per channel help to address the relentless pressure to reduce the cost of test,” Lev stated in the press release. “We are delighted that Advanced Packaging has recognized the excellence of the Diamond MultiWave by presenting us with this award.”

“We congratulate Credence on its win of the prestigious Best New Product award in the Testing Equipment and Services category,” Gail Flower, editor-in-chief of Advanced Packaging magazine stated. “Advanced Packaging is proud to continue its tradition of recognizing excellence in this segment of the industry. In recent years, innovations in advanced packaging processes, materials, and equipment have been driving the semiconductor industry forward. Now more than ever, it’s important to acknowledge the achievements of these innovators.”

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